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Laser Doping Technology


Principle


The laser doping intelligent manufacturing equipment uses laser doping technology to perform heavy doping in the contact part of the metal gate line (electrode) with the silicon wafer, while maintaining light doping (low concentration doping) outside the electrode. This structure reduces the recombination of the minority cassette on the emitter surface, and the metal electrode and emitter can form a good ohmic contact, so as to obtain higher short-circuit current, open-circuit voltage and fill factor, and improve the conversion efficiency of solar cells.



Process Introduction

Process Introduction

The addition of laser doping intelligent manufacturing equipment in the conventional production line can realize the upgrade and transformation of the selective emitter solar cell in the PERC production line, with the conversion efficiency easily increased by 0.2~0.3% and the power of the standard module easily increased by 3~5W.